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--- flexiblestickypcbfabrication [2020/09/02 11:11] – zohar
+++ flexiblestickypcbfabrication [2020/09/03 15:11] (current) – zohar
@@ Line 9: / Line 9: @@
 ^**Materials: **  ^**Chemicals: ** ^**Tools: ** ^**Software: ** ^
-|Copper Tape 50mm \\ Kapton Tape 50mm\\ Masking Tape 20mm\\ Sellotape (clear)\\ A4 Printer Paper \\ A4 pvc for laser printer\\ Steel Wool  | [[ http://www.tech-place.com/en/photosensitive-materials/23-photosensitive-film.html|PhotoSensitive Dry Film]]\\ Sodium Carbonate\\ Ferric Chloride\\ Citric Acid\\ Acetone  |Ruler (30cm) \\ Precision Knife\\ Scissors\\ Laser Printer\\ Laminator (A4)\\ UV Box\\ Timer\\ Kitchen Towel |[[https://inkscape.com|Inkscape]]||{{ :img_20200827_121558.jpg?300&direct}}| |
+|Copper Tape 50mm \\ Kapton Tape 50mm\\ Masking Tape 20mm\\ Sellotape (clear)\\ A4 Printer Paper \\ A4 pvc for laser printer\\ Steel Wool  | [[ http://www.tech-place.com/en/photosensitive-materials/23-photosensitive-film.html|PhotoSensitive Dry Film]]\\ Sodium Carbonate\\ Ferric Chloride\\ Citric Acid\\ Acetone  |Ruler (30cm) \\ Precision Knife\\ Scissors\\ Laser Printer\\ Laminator (A4)\\ UV Box\\ Etching Tank\\ Timer\\ Scale\\ Disposable Gloves\\ Kitchen Towel\\ Cotton Ball | [[https://inkscape.com|Inkscape]]||{{ :img_20200827_121558.jpg?300&direct}}| |
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 |{{:pasted:20200829-195540.png?300&direct}}|{{:pasted:20200829-195347.png?300&direct}}|{{:pasted:20200829-195436.png?300&direct}}|
 | a) Remove copper tape gently from \\ the application paper. | b) Attach application paper glossy side \\ To the kapton tape sticky side. | c) Cut kapton tape.|
 |{{:pasted:20200829-200620.png?300&direct}}|{{:pasted:20200829-200657.png?300&direct}}|{{:pasted:20200829-200705.png?300&direct}}|
 | d) Apply copper tape on\\ kapton tape upper side. | e) Clean copper side\\ gently with steel wool. | f) Flexible clad is ready! |
 ===2 . Applying PhotoSensitive Dry Film on Flexible Copper Tape Clad ===
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 |{{:pasted:20200830-095958.png?300&direct}}|{{:pasted:20200830-100138.png?300&direct}}|{{:pasted:20200830-100223.png?300&direct}}|
-| d) Tape two PhotoMask layers with a clear\\ sellotape. check for alignment and direction!.\\ two layers are used for a darker black\\ color and better light proof.\\    | e) Cut Copper clad at the size of the photomask | f) |
+| d) Tape two PhotoMask layers with a clear\\ sellotape. check for alignment and direction!.\\ two layers are used for a darker black\\ color and better light proof.\\    | e) Cut Copper clad at the size of the circuit\\ cut it a bit smaller from the photomask. | f) Position photo mask onto the copper clad\\ and tape it from the bottom side with 20mm\\ masking tape.\\ check for alignment and direction!|
 |{{:pasted:20200830-103510.png?300&direct}}|{{:pasted:20200830-103543.png?300&direct}}|{{:pasted:20200830-103609.png?300&direct}}|
-| h)  | i) | j) |
+| h) Place copper clad taped with photomask\\ onto UV light Box face down.\\ lock the UV box lid.  | i) Expose to UV light for 1:15 min. | j) Remove photomask from the copper clad\\ keep the clad in a dark place!\\ remove photosensitive dry film top protection layer\\ from the copper clad before developing stage. |
 ===4 . Developing Process ===
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 |{{:pasted:20200830-104219.png?300&direct}} |{{:pasted:20200830-104248.png?300&direct}} |{{:pasted:20200830-104315.png?300&direct}} |
-| a)  | b)  | c) |
+| a) Prepare Developing solution in a plastic container\\ 2g sodium carbonate : 200 ml water  | b) Place the exposed clad in the developer\\ and wait for 3-3.5 minutes.\\ when clad is completely developed, take out\\ from developing solution and rinse\\ the clad gently in water. | c) Place developed clad on\\ a kitchen towel and let it dry. |
 ===5 . Etching ===
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 |{{:pasted:20200830-104439.png?300&direct}} |{{:pasted:20200830-104558.png?300&direct}} |{{:pasted:20200830-104626.png?300&direct}} |
-| a)  | b)  | c) |
+| a) We use ferric chloride as our etchant\\ based on the [[ https://www.polymetaal.nl/beguin/mape/edinburgh_etch.htm|Edinburgh Etch for Copper mix]]\\ 1 liter saturated ferric chloride solution(40%)\\ 200ml tap water, 66.6g citric acid\\ working temperature 50C.\\ work with disposable gloves on etching part! | b) Etching time takes around 7 - 20 min.\\ depends on clad size and copper surface to etch.  | c) Once Circuit is fully etched\\ rinse it gently with water.\\ Place Etched Circuit on a kitchen towel\\ and let it dry.|
 ===6 . Removing PhotoSensitive Dry Film From Copper Traces ===
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 |{{:pasted:20200831-064651.png?300&direct}}|{{:pasted:20200831-065055.png?300&direct}}|{{:pasted:20200831-065128.png?300&direct}} |
-| a)  | b)  | c) |
+| a) Place etched circuit in a plastic container.\\ pour acetone on the circuit and wait few seconds\\ till the photosensitive dry film dissolves.  | b) Wipe gently the dissolved photosensitive dry\\ film. use a cotton ball.  | c) Once all the photosensitive dry film is removed\\ from copper traces. rinse the circuit with water.\\ Place Etched Circuit on a kitchen towel\\ and let it dry. Done!  |